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Part Name(s) : 21-0136F
Maxim Integrated
Description : PACKAGE OUTLINE 12, 16L THIN QFN, 3x3x0.8mm
Part Name(s) : 21-0139A
Maxim Integrated
Description : PACKAGE OUTLINE 12,16,20,24L QFN THIN, 4x4x0.8 mm
Part Name(s) : 21-0159
Dallas Semiconductor -> Maxim Integrated
Description : PACKAGE OUTLINE, 40L THIN QFN 5x5x0.8mm BODY / 0.4mm LEAD PITCH
Part Name(s) : 21-0041
Maxim Integrated
Description : PACKAGE OUTLINE, 8L, 14L,16L, SOIC .150 INCH
Part Name(s) : 21-0102
Dallas Semiconductor -> Maxim Integrated
Description : PACKAGE OUTLINE, 12,16L QFN, 3x3x0.90 MM
Part Name(s) : 56-G6005-001
Dallas Semiconductor -> Maxim Integrated
Description : MARKETING OUTLINE - 16L CHIP SCALE BGA (4X4) 1.0MM PITCH, 1.41 THICK, 2 LAYER
Part Name(s) : MDP0044
Elantec -> Intersil
Description : TSSOP (Thin-Shrink Small OUTLINE PACKAGE) Family
Part Name(s) : SC70-6 SOT363 SC70-6/SOT363
Global Mixed-mode Technology Inc
Description : PACKAGE OUTLINE
Part Name(s) : TSSOP-20-EP
Global Mixed-mode Technology Inc
Description : PACKAGE OUTLINE
Future Technology
Description : Dual High Speed USB to Multipurpose UART/FIFO IC
Part Name(s) : SC70-5 SOT353
Global Mixed-mode Technology Inc
Description : PACKAGE OUTLINE
